IP Library Granted Patent US 5,280,194
Granted Patent Utility
US 5,280,194 · App. 07/940,763

Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device

Inventors: John G. Richards, Hector Flores, Wendell B. Sander
Patented Case View Patent ↗
Granted: Jan 18, 1994 Filed: Sep 4, 1992
Inventors
John G. Richards
Hector Flores
Wendell B. Sander
Assignee (at issue)
Micron Technology, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

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Quick Facts
Patent No.
US 5,280,194
App. No.
07/940,763
Filed
1992-09-04
Granted
1994-01-18
Kind
A