IP Library › Granted Patent US 5,282,111
Granted Patent Utility
US 5,282,111 · App. 07/871,586

Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate

Inventor: Albert N. Hopfer
Patented Case View Patent ↗
Granted: Jan 25, 1994 Filed: Apr 20, 1992
Inventor
Albert N. Hopfer
Assignee (at issue)
Labinal Components and Systems, Inc.

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Quick Facts
Patent No.
US 5,282,111
App. No.
07/871,586
Filed
1992-04-20
Granted
1994-01-25
Kind
A