Granted Patent
Utility
US 5,283,948 · App. 07/708,447
Method of manufacturing interconnect bumps
Inventors:
Paul E. Schroeder, Deanna M. Dowdle
Patented Case
View Patent ↗
Granted: Feb 8, 1994
Filed: May 31, 1991
Inventors
Paul E. Schroeder
Deanna M. Dowdle
Assignee (at issue)
Cray Research, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.