IP Library Granted Patent US 5,286,344
Granted Patent Utility
US 5,286,344 · App. 07/898,505

Process for selectively etching a layer of silicon dioxide on an underlying stop layer of silicon nitride

Inventors: Guy T. Blalock, David S. Becker, Fred L. Roe
Patented Case View Patent ↗
Granted: Feb 15, 1994 Filed: Jun 15, 1992
Inventors
Guy T. Blalock
David S. Becker
Fred L. Roe
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 5,286,344
App. No.
07/898,505
Filed
1992-06-15
Granted
1994-02-15
Kind
A