Granted Patent
Utility
US 5,286,679 · App. 07/033,140
Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
Inventors:
Warren M. Farnworth, Ed A. Shrock, Scott Clifford, Jerrold L. King, Walter L. Moden
Patented Case
View Patent ↗
Granted: Feb 15, 1994
Filed: Mar 18, 1993
Inventors
Warren M. Farnworth
Ed A. Shrock
Scott Clifford
Jerrold L. King
Walter L. Moden
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.