Granted Patent
Utility
US 5,288,948 · App. 07/778,881
Structure of a semiconductor chip having a conductive layer
Inventors:
Yasuhiro Fukuda, Tetsuhiko Sugahara, Norio Hirashita, Mitsuhiro Matsuo, Minoru Saito, Masayuki Kobayakawa, Fumitaka Yokoyama
Patented Case
View Patent ↗
Granted: Feb 22, 1994
Filed: Dec 26, 1991
Inventors
Yasuhiro Fukuda
Tetsuhiko Sugahara
Norio Hirashita
Mitsuhiro Matsuo
Minoru Saito
Masayuki Kobayakawa
Fumitaka Yokoyama
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.