Granted Patent
Utility
US 5,289,038 · App. 07/967,400
Bump electrode structure and semiconductor chip having the same
Inventor:
Akira Amano
Patented Case
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Granted: Feb 22, 1994
Filed: Oct 28, 1992
Inventor
Akira Amano
Assignee (at issue)
FUJI ELECTRIC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.