Granted Patent
Utility
US 5,299,729 · App. 07/937,466
Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
Inventors:
Akira Matsushita, Hidekazu Konishi
Patented Case
View Patent ↗
Granted: Apr 5, 1994
Filed: Aug 28, 1992
Inventors
Akira Matsushita
Hidekazu Konishi
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.