Granted Patent
Utility
US 5,307,237 · App. 07/938,064
Integrated circuit packaging with improved heat transfer and reduced signal degradation
Inventor:
Dale D. Walz
Patented Case
View Patent ↗
Granted: Apr 26, 1994
Filed: Aug 31, 1992
Inventor
Dale D. Walz
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.