Granted Patent
Utility
US 5,309,019 · App. 08/023,407
Low inductance lead frame for a semiconductor package
Inventors:
Daniel D. Moline, Bernard E. Weir, III
Patented Case
View Patent ↗
Granted: May 3, 1994
Filed: Feb 26, 1993
Inventors
Daniel D. Moline
Bernard E. Weir, III
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.