Granted Patent
Utility
US 5,316,610 · App. 07/992,909
Bonding apparatus
Inventors:
Tomohiro Tamaki, Kenzo Hatada, Hiroaki Fujimoto, Yoshinobu Takeshita
Patented Case
View Patent ↗
Granted: May 31, 1994
Filed: Dec 18, 1992
Inventors
Tomohiro Tamaki
Kenzo Hatada
Hiroaki Fujimoto
Yoshinobu Takeshita
Assignees (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.