Granted Patent
Utility
US 5,322,565 · App. 07/810,246
Method and apparatus for through hole substrate printing
Inventors:
Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Bruce A. Myers, Charles T. Eytcheson
Patented Case
View Patent ↗
Granted: Jun 21, 1994
Filed: Dec 19, 1991
Inventors
Joseph M. Zachman
Clyde E. Ragan
Steven L. Alexander
Bruce A. Myers
Charles T. Eytcheson
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.