IP Library › Granted Patent US 5,328,870
Granted Patent Utility
US 5,328,870 · App. 07/973,354

Method for forming plastic molded package with heat sink for integrated circuit devices

Inventor: Robert C. Marrs
Patented Case View Patent ↗
Granted: Jul 12, 1994 Filed: Nov 9, 1992
Inventor
Robert C. Marrs
Assignee (at issue)
Amkor Electronics, Inc.

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Quick Facts
Patent No.
US 5,328,870
App. No.
07/973,354
Filed
1992-11-09
Granted
1994-07-12
Kind
A