Granted Patent
Utility
US 5,334,029 · App. 08/059,844
High density connector for stacked circuit boards
Inventors:
Kaushik S. Akkapeddi, Rocco Bonanni, Robert J. Gashler, Michael Gregory German, William LAMBERT, Eugene C. Schramm
Patented Case
View Patent ↗
Granted: Aug 2, 1994
Filed: May 11, 1993
Inventors
Kaushik S. Akkapeddi
Rocco Bonanni
Robert J. Gashler
Michael Gregory German
William LAMBERT
Eugene C. Schramm
Assignee (at issue)
AT&T Bell Laboratories
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.