Granted Patent
Utility
US 5,334,552 · App. 07/980,901
Method for fabricating a semiconductor device having a multi-layered interconnection structure
Inventor:
Tetsuya Homma
Patented Case
View Patent ↗
Granted: Aug 2, 1994
Filed: Nov 24, 1992
Inventor
Tetsuya Homma
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.