Granted Patent
Utility
US 5,334,873 · App. 07/872,154
Semiconductor packages with centrally located electrode pads
Inventor:
Gi Bon Cha
Patented Case
View Patent ↗
Granted: Aug 2, 1994
Filed: Apr 22, 1992
Inventor
Gi Bon Cha
Assignee (at issue)
Goldstar Electron Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.