Granted Patent
Utility
US 5,338,970 · App. 08/036,564
Multi-layered integrated circuit package with improved high frequency performance
Inventors:
Steven R. Boyle, Robert J. Proebsting, William H. Herndon
Patented Case
View Patent ↗
Granted: Aug 16, 1994
Filed: Mar 24, 1993
Inventors
Steven R. Boyle
Robert J. Proebsting
William H. Herndon
Assignee (at issue)
Intergraph Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.