IP Library › Granted Patent US 5,338,975
Granted Patent Utility
US 5,338,975 · App. 07/546,965

High density interconnect structure including a spacer structure and a gap

Inventors: Herbert S. Cole, James Wilson Rose
Patented Case View Patent ↗
Granted: Aug 16, 1994 Filed: Jul 2, 1990
Inventors
Herbert S. Cole
James Wilson Rose
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 5,338,975
App. No.
07/546,965
Filed
1990-07-02
Granted
1994-08-16
Kind
A