Granted Patent
Utility
US 5,339,536 · App. 08/124,566
Apparatus and method for solder paste printing process for printed circuit boards
Inventor:
Scott K. Buttars
Patented Case
View Patent ↗
Granted: Aug 23, 1994
Filed: Sep 20, 1993
Inventor
Scott K. Buttars
Assignee (at issue)
Compaq Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.