Granted Patent
Utility
US 5,342,807 · App. 07/976,093
Soft bond for semiconductor dies
Inventors:
Larry D. Kinsman, Derek Gochnour, Alan G. Wood, Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Aug 30, 1994
Filed: Nov 13, 1992
Inventors
Larry D. Kinsman
Derek Gochnour
Alan G. Wood
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.