IP Library › Granted Patent US 5,342,999
Granted Patent Utility
US 5,342,999 · App. 07/994,380

Apparatus for adapting semiconductor die pads and method therefor

Inventors: John K. Frei, Kenneth Brice-Heames
Patented Case View Patent ↗
Granted: Aug 30, 1994 Filed: Dec 21, 1992
Inventors
John K. Frei
Kenneth Brice-Heames
Assignee (at issue)
Motorola, Inc.

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Quick Facts
Patent No.
US 5,342,999
App. No.
07/994,380
Filed
1992-12-21
Granted
1994-08-30
Kind
A