IP Library › Granted Patent US 5,346,584
Granted Patent Utility
US 5,346,584 · App. 08/098,164

Planarization process for IC trench isolation using oxidized polysilicon filler

Inventors: Andre I. Nasr, Steven S. Cooperman
Patented Case View Patent ↗
Granted: Sep 13, 1994 Filed: Jul 28, 1993
Inventors
Andre I. Nasr
Steven S. Cooperman
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 5,346,584
App. No.
08/098,164
Filed
1993-07-28
Granted
1994-09-13
Kind
A