IP Library › Granted Patent US 5,348,607
Granted Patent Utility
US 5,348,607 · App. 08/020,913

High density interconnect thermoplastic die attach material and solvent die attach processing

Inventors: Robert J. Wojnarowski, Charles W. Eichelberger
Patented Case View Patent ↗
Granted: Sep 20, 1994 Filed: Feb 22, 1993
Inventors
Robert J. Wojnarowski
Charles W. Eichelberger
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 5,348,607
App. No.
08/020,913
Filed
1993-02-22
Granted
1994-09-20
Kind
A