Granted Patent
Utility
US 5,355,283 · App. 08/047,721
Ball grid array with via interconnection
Inventors:
Robert C. Marrs, Tadashi Hirakawa
Patented Case
View Patent ↗
Granted: Oct 11, 1994
Filed: Apr 14, 1993
Inventors
Robert C. Marrs
Tadashi Hirakawa
Assignees (at issue)
Amkor Electronics, Inc.
TEIJIN LIMITED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.