Granted Patent
Utility
US 5,362,667 · App. 07/921,197
Bonded wafer processing
Inventors:
Jack H. Linn, Robert K. Lowry, George V. Rouse, James F. Buller, William H. Speece
Patented Case
View Patent ↗
Granted: Nov 8, 1994
Filed: Jul 28, 1992
Inventors
Jack H. Linn
Robert K. Lowry
George V. Rouse
James F. Buller
William H. Speece
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.