Granted Patent
Utility
US 5,363,048 · App. 07/977,531
Method and system for ensuring interconnect integrity in a micro-chip-module
Inventors:
Douglas N. Modlin, Joel W. Parke, Deng-Yuan Fu
Patented Case
View Patent ↗
Granted: Nov 8, 1994
Filed: Nov 17, 1992
Inventors
Douglas N. Modlin
Joel W. Parke
Deng-Yuan Fu
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.