Granted Patent
Utility
US 5,364,004 · App. 08/060,085
Wedge bump bonding apparatus and method
Inventor:
R. Paul Davidson
Patented Case
View Patent ↗
Granted: Nov 15, 1994
Filed: May 10, 1993
Inventor
R. Paul Davidson
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.