Granted Patent
Utility
US 5,366,932 · App. 08/051,832
Semi-conductor chip packaging method and semi-conductor chip having interdigitated gate runners with gate bonding pads
Inventor:
Victor A. K. Temple
Patented Case
View Patent ↗
Granted: Nov 22, 1994
Filed: Apr 26, 1993
Inventor
Victor A. K. Temple
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.