IP Library Granted Patent US 5,367,191
Granted Patent Utility
US 5,367,191 · App. 07/945,713

Leadframe and resin-sealed semiconductor device

Inventor: Kazumi Ebihara
Patented Case View Patent ↗
Granted: Nov 22, 1994 Filed: Sep 16, 1992
Inventor
Kazumi Ebihara
Assignees (at issue)
Fujitsu Limited
Kyushu Fujitsu Electronics Limited

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Quick Facts
Patent No.
US 5,367,191
App. No.
07/945,713
Filed
1992-09-16
Granted
1994-11-22
Kind
A