Granted Patent
Utility
US 5,367,194 · App. 07/872,467
Microchip assembly with electrical element in sealed cavity
Inventor:
Christopher Beatty
Patented Case
View Patent ↗
Granted: Nov 22, 1994
Filed: Apr 23, 1992
Inventor
Christopher Beatty
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.