Granted Patent
Utility
US 5,367,765 · App. 07/995,525
Method of fabricating integrated circuit chip package
Inventor:
Teruo Kusaka
Patented Case
View Patent ↗
Granted: Nov 29, 1994
Filed: Dec 23, 1992
Inventor
Teruo Kusaka
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.