Granted Patent
Utility
US 5,367,766 · App. 08/043,196
Ultra high density integrated circuit packages method
Inventors:
Carmen D. Burns, Jerry M. Roane, James W. Cady
Patented Case
View Patent ↗
Granted: Nov 29, 1994
Filed: Apr 5, 1993
Inventors
Carmen D. Burns
Jerry M. Roane
James W. Cady
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.