Granted Patent
Utility
US 5,369,300 · App. 08/075,182
Multilayer metallization for silicon semiconductor devices including a diffusion barrier formed of amorphous tungsten/silicon
Inventors:
Robert J. Heideman, Randy A. Rusch, Michael S. Baird
Patented Case
View Patent ↗
Granted: Nov 29, 1994
Filed: Jun 10, 1993
Inventors
Robert J. Heideman
Randy A. Rusch
Michael S. Baird
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.