IP Library Granted Patent US 5,374,582
Granted Patent Utility
US 5,374,582 · App. 08/233,940

Laminated substrate for semiconductor device and manufacturing method thereof

Inventors: Kensuke Okonogi, Hiroaki Kikuchi
Patented Case View Patent ↗
Granted: Dec 20, 1994 Filed: Apr 28, 1994
Inventors
Kensuke Okonogi
Hiroaki Kikuchi
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,374,582
App. No.
08/233,940
Filed
1994-04-28
Granted
1994-12-20
Kind
A