Granted Patent
Utility
US 5,376,580 · App. 08/036,532
Wafer bonding of light emitting diode layers
Inventors:
Fred A. Kish, Jr., Frank M. Steranka, Dennis C. DeFevere, Virginia Robbins, John Uebbing
Patented Case
View Patent ↗
Granted: Dec 27, 1994
Filed: Mar 19, 1993
Inventors
Fred A. Kish, Jr.
Frank M. Steranka
Dennis C. DeFevere
Virginia Robbins
John Uebbing
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.