Granted Patent
Utility
US 5,377,899 · App. 08/188,831
Method for producing solder that contains therein additive particles maintaining its shape
Inventor:
Mitsuru Hashimoto
Patented Case
View Patent ↗
Granted: Jan 3, 1995
Filed: Jan 31, 1994
Inventor
Mitsuru Hashimoto
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.