Granted Patent
Utility
US 5,380,679 · App. 08/130,854
Process for forming a multilayer wiring conductor structure in semiconductor device
Inventor:
Isao Kano
Patented Case
View Patent ↗
Granted: Jan 10, 1995
Filed: Oct 4, 1993
Inventor
Isao Kano
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.