IP Library › Granted Patent US 5,384,073
Granted Patent Utility
US 5,384,073 · App. 08/185,103

Ligand gold bonding

Inventors: Brian L. Shigekawa, Yung-Ao Hsieh
Patented Case View Patent ↗
Granted: Jan 24, 1995 Filed: Jan 21, 1994
Inventors
Brian L. Shigekawa
Yung-Ao Hsieh
Assignee (at issue)
Akzo N.V.

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Quick Facts
Patent No.
US 5,384,073
App. No.
08/185,103
Filed
1994-01-21
Granted
1995-01-24
Kind
A