Granted Patent
Utility
US 5,384,284 · App. 08/130,225
Method to form a low resistant bond pad interconnect
Inventors:
Trung T. Doan, Mark E. Tuttle
Patented Case
View Patent ↗
Granted: Jan 24, 1995
Filed: Oct 1, 1993
Inventors
Trung T. Doan
Mark E. Tuttle
Assignee (at issue)
Micron Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.