IP Library › Granted Patent US 5,384,691
Granted Patent Utility
US 5,384,691 · App. 08/002,374

High density interconnect multi-chip modules including embedded distributed power supply elements

Inventors: Constantine A. Neugebauer, Charles Steven Korman, David Bates, William Hull Bicknell, Wolfgang Daum
Patented Case View Patent ↗
Granted: Jan 24, 1995 Filed: Jan 8, 1993
Inventors
Constantine A. Neugebauer
Charles Steven Korman
David Bates
William Hull Bicknell
Wolfgang Daum
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 5,384,691
App. No.
08/002,374
Filed
1993-01-08
Granted
1995-01-24
Kind
A