Granted Patent
Utility
US 5,385,290 · App. 08/158,131
Soldering material and procedure
Inventor:
Yinon Degani
Patented Case
View Patent ↗
Granted: Jan 31, 1995
Filed: Nov 24, 1993
Inventor
Yinon Degani
Assignee (at issue)
AT&T CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.