Granted Patent
Utility
US 5,385,291 · App. 08/179,396
Method employing an elevating of atmospheric pressure during the heating and/or cooling phases of ball grid array (BGA) soldering of an IC device to a PCB
Inventor:
Richard W. Latta
Patented Case
View Patent ↗
Granted: Jan 31, 1995
Filed: Jan 10, 1994
Inventor
Richard W. Latta
Assignee (at issue)
Micron Custom Manufacturing Services Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.