Granted Patent
Utility
US 5,385,867 · App. 08/216,968
Method for forming a multi-layer metallic wiring structure
Inventors:
Tetsuya Ueda, Kousaku Yano, Tomoyasu Murakami, Michinari Yamanaka, Shuji Hirao, Noboru Nomura
Patented Case
View Patent ↗
Granted: Jan 31, 1995
Filed: Mar 24, 1994
Inventors
Tetsuya Ueda
Kousaku Yano
Tomoyasu Murakami
Michinari Yamanaka
Shuji Hirao
Noboru Nomura
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.