Granted Patent
Utility
US 5,386,339 · App. 08/098,996
Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
Inventor:
Paul W. Polinski, Sr.
Patented Case
View Patent ↗
Granted: Jan 31, 1995
Filed: Jul 29, 1993
Inventor
Paul W. Polinski, Sr.
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.