Granted Patent
Utility
US 5,396,403 · App. 08/088,288
Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
Inventor:
Chandrakant Patel
Patented Case
View Patent ↗
Granted: Mar 7, 1995
Filed: Jul 6, 1993
Inventor
Chandrakant Patel
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.