IP Library Granted Patent US 5,397,915
Granted Patent Utility
US 5,397,915 · App. 07/834,466

Semiconductor element mounting die pad including a plurality of extending portions

Inventor: Sachiyuki Nose
Patented Case View Patent ↗
Granted: Mar 14, 1995 Filed: Feb 12, 1992
Inventor
Sachiyuki Nose
Assignee (at issue)
Matsushita Electronics Corporation

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Quick Facts
Patent No.
US 5,397,915
App. No.
07/834,466
Filed
1992-02-12
Granted
1995-03-14
Kind
A