Granted Patent
Utility
US 5,397,917 · App. 08/051,954
Semiconductor package capable of spreading heat
Inventors:
Denise Ommen, Chi-Taou Tsai, John Baird
Patented Case
View Patent ↗
Granted: Mar 14, 1995
Filed: Apr 26, 1993
Inventors
Denise Ommen
Chi-Taou Tsai
John Baird
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.