Granted Patent
Utility
US 5,399,523 · App. 08/271,563
Method for the rapid thermal processing of a semiconductor wafer by irradiation
Inventor:
Ronald Kakoschke
Patented Case
View Patent ↗
Granted: Mar 21, 1995
Filed: Jul 7, 1994
Inventor
Ronald Kakoschke
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.