Granted Patent
Utility
US 5,400,950 · App. 08/199,869
Method for controlling solder bump height for flip chip integrated circuit devices
Inventors:
Bruce A. Myers, Petrina L. Schnabel
Patented Case
View Patent ↗
Granted: Mar 28, 1995
Filed: Feb 22, 1994
Inventors
Bruce A. Myers
Petrina L. Schnabel
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.