Granted Patent
Utility
US 5,406,121 · App. 08/099,598
Semiconductor device having improved interconnection wiring structure
Inventor:
Shuji Toyoda
Patented Case
View Patent ↗
Granted: Apr 11, 1995
Filed: Jul 30, 1993
Inventor
Shuji Toyoda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.